Anchor-Seal Electronic Component Encapsulants
Thermal shock resistant, heat dissipation, flame retardant, electrical insulation
.
Product #
Color |
Shore
Hardness
|
Pot Life
100 Grams
@77F |
Typical
Cure Time |
Specific
Gravity
Grams/CC |
Viscosity
@ 77F
CPS |
Mix Ratio
Resin/Cure
Wt (Vol) |
|
SY5662
Gray
|
82D |
60 minutes |
45 minutes @ 140F |
1.08 |
Limited Flow |
100 : 85 (1 : 1) |
| MSDS Sheets: SY5662 - Pt A, SY5662 - Pt B |
Limited Flow Paste, Good Moisture Resistance, Excellent Adhesion, Adhesive -Coating, Sealing, Encapsulation |
 |
|
SY6009N
Light Gray
|
92D |
45 minutes |
4-12 hrs @ 77F |
2.27 |
44000 |
100 : 6 |
| MSDS Sheets: SY6009N - Pt A, SY6009N - Pt B |
Fast Curing, Thermally Conductive, Low Thermal Expansion, Electrical Encapsulant for Insulators, Bushings, Power Supplies and Transformers |
 |
|
SY6014S
Water Clear
|
84D |
1 hour |
3-6 hrs @ 125-175F |
1.12 |
700 |
100 : 32/35 |
| MSDS Sheets: SY6014S - Pt A, SY6014S - Pt B |
Low Viscosity, Water Resistant, High Strength, Clear, No Blush, Electrical Encapsulant for Tightly Spaced Components, Coils and Sensors |
 |
|
SY6023LV
Black
|
85D |
3 hours |
3 hrs @ 140F |
1.45 |
1000 |
100 : 15 |
|
MSDS Sheets: SY023LV - Pt A, SY6023LV - Part B
|
High Gloss, No Blush, Excellent Water Resistance, Thermal Shock Crack Resistant, Electrical Encapsulation, High VoltageTransformers |
 |
|
SY6024
Black
|
85D |
2-3 hours |
4 hrs @ 140F |
1.57 |
3600 |
100 : 15 (4 : 1) |
|
MSDS Sheets: SY6024 - Pt A, SY6023 Pt B
|
High Gloss, No Blush, Low Dielectric Constant, Low Viscosity, Low Stress, Thermal Shock Resistant, Power Supplies, Coils, High Voltage Transformers |
 |
|
SY6024HV
Black
|
85D |
1 hour |
4 hrs @ 140F |
1.57 |
10000 |
100 : 15 (4 : 1) |
|
MSDS Sheets: SY6024HV - Pt A, SY6024HV - Pt B
|
Low Stress, Low Dielectric Constant, Med Viscosity, Water & Chemical Resistant,Adhesive, Coating, Coils and Windings, Low Stress Potting |
 |
|
SY6570*
Gray
|
75D |
>24 hours |
10 min @ 300F |
1.9 |
LTD Flow |
100 : 100
(1 : 1)
|
| MSDS Sheets: SY6570-Pt A, SY6570-Pt B |
Chip Bonding, Globe Top, Semiconductor, Thermally Conductive, Anhydride |
 |
|
SY6659ST
Black |
88D |
35 minutes |
1-2 hrs @ 140F |
1.62 |
Limited Flow |
100 : 6 |
| MSDS Sheets: SY6659ST - Pt A, SY6659ST - Pt B |
Moderately Fast Curing, Limited Drip, Heat & Chemical Resistant, Electrical Potting of Devices with Gaps & Poor Sealing |
 |
* Ships DOT Non-Regulated
Viscosity Chart
1 cps = Water
400 cps = #10 Motor Oil
1,000 cps = Castor Oil
3,500 cps = Karo Syrup
25,000 cps = Hershey’s Chocolate Syrup |
|
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